Unique FET Spunbond Technology showcased at INDEX20

FET will introduce its new lab-scale Spunbond system at the INDEX20 nonwovens exhibition, stand 1163, taking place in Geneva, Switzerland, from October 19-22.

Complementing the company’s successful meltblown technology, the new spunbond range provides unprecedented opportunities for the scaled development of new nonwoven fabrics based on a wide range of fibres and polymers, including bicomponents.

The market availability of this new technology is particularly timely, given the industry’s current preoccupation with the development of new substrates based on biopolymers, sustainable resins or recycled fibres. FET has already supplied one of these new spunbond lines to University of Leeds in the UK, and a second, in combination with a meltblown line, to the University of Erlangen-Nuremberg in Germany.

MD Richard Slack comments “We look forward to discussing the possibilities of this versatile new system with interested parties at INDEX20 in Geneva,”. “It is capable of processing pure polymer with no requirement for processing aids or additives, to obtain a wide range of structural and mechanical properties, and there are numerous options for the post-processing of the webs.”